Samsung Launches World's Thinnest LPDDR5X DRAM for Next-Gen Mobile Devices

[{"selector":"#anim-89807dc7-17e8-478b-9969-aba8bf14155c","keyframes":{"opacity":[0,1]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"both"}] [{"selector":"#anim-421ec023-4c4f-4ad8-a7a4-8cd083206f44","keyframes":{"transform":["scale(0.3333333333333333)","scale(1)"]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"forwards"}] Samsung Launches World's Thinnest LPDDR5X DRAM for Next-Gen Mobile Devices

[{"selector":"#anim-f32e1870-c71a-48b4-83e3-374751c450f4","keyframes":{"opacity":[0,1]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"both"}] [{"selector":"#anim-6413b222-2d41-4fea-859f-884ad0f98de0","keyframes":{"transform":["scale(0.3333333333333333)","scale(1)"]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"forwards"}] Mass Production Announcement – Samsung has announced the mass production of the industry's thinnest 12-nanometer (nm) LPDDR5X DRAM packages. – Available in 12 and 16 gigabytes (GB) capacities.

[{"selector":"#anim-b9abefcc-b63b-48ad-b5a6-9f9a8fcbb3de","keyframes":{"opacity":[0,1]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"both"}] [{"selector":"#anim-f2771d1f-e028-48ca-ab63-881db7c4b08c","keyframes":{"transform":["scale(0.3333333333333333)","scale(1)"]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"forwards"}] Key Features – Ultraslim LPDDR5X DRAM packages maximize space within mobile devices. – Enhances airflow and thermal control. – Approximately 9% thinner than the previous generation. – 21.2% improved heat resistance.

[{"selector":"#anim-18f98f53-a01e-4ddf-9cac-8920b2be3e94","keyframes":{"opacity":[0,1]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"both"}] [{"selector":"#anim-c8218e02-6682-4939-a40c-816285b56667","keyframes":{"transform":["scale(0.3333333333333333)","scale(1)"]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"forwards"}] Advanced Capabilities – Crucial for high-performance applications with advanced capabilities like on-device AI. – Achieves 0.65-millimeter (mm) thickness through optimized PCB and EMC techniques. – Refined back-lapping process minimizes package height.

[{"selector":"#anim-d7e4a051-dda5-4f41-aea7-4c11e5e6f6b3","keyframes":{"opacity":[0,1]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"both"}] [{"selector":"#anim-629d0334-ef00-45d1-a1c2-64c866ea87aa","keyframes":{"transform":["scale(0.3333333333333333)","scale(1)"]},"delay":0,"duration":2000,"easing":"cubic-bezier(.3,0,.55,1)","fill":"forwards"}] Samsung aims to supply its 0.65mm LPDDR5X DRAM to mobile processor and device manufacturers. Plans to introduce even thinner LPDDR DRAM packages: – 6-layer 24GB modules – 8-layer 32GB modules