MediaTek launches Dimensity 7050 chipset, will debut on powered Lava Agni 2 5G

HIGHLIGHTS

* MediaTek has officially launched the MediaTek Dimensity 7050 chipset.
* Lava Agni 2 5G will be the first phone in India to be powered by the chipset.
* The chip is made to give gamers an edge with MediaTek HyperEngine gaming improvements.

A couple of days back, MediaTek quietly unveiled mobile chipset called Dimensity 7050. Though it sounds like a new chip, it actually is the same as Dimensity 1080 in terms of specs.

This SoC will debut first on the Realme 11 Pro Plus, which is scheduled to launch on May 10. Today, yet another OEM has confirmed to use this chipset.

Indian smartphone brand Lava has officially revealed that it will be using the MediaTek
Dimensity 7050 chip inside the upcoming Lava Agni 2 5G. Prior to the announcement, the brand had been already teasing the arrival of this phone.

According to a leak, the Agni 2 5G will be priced below <25,000. It will be built around a 120Hz AMOLED display.

The handset will sport an OIS-assisted 50 primary camera and a 16MP front-facing camera. It will boot Android and will be backed by a 5,000mAh battery. Finally, it will carry support for 44W charging.

Talking about the Dimensity 7050 So, it consists of an octa-core CPU featuring 2 × 2.6GHz Cortex-A78 cores and 4 x 2.0GHz Cortex-A55 cores. The graphics are handled by Mali G68 MC4 GPU and there’s an Al processing unit for imaging and other stuff.

The chip is built on TSMC’s 6m fabrication process. Thus, it is power-efficient and supports dual 5G SIM along with VoNR.

The upcoming Lava Agni 2 5G is confirmed to be launched with the MediaTek Dimensity 7050 chipset. According to MediaTek, the homegrown smartphone brand has become the country’s first original equipment manufacturer (OEM) to collaborate with the chipmaker for the newly launched chipset.

As per MediaTek, the chip is made to give gamers an edge with MediaTek HyperEngine gaming improvements, take excellent images with its advanced camera technologies, and streamers with powerful MiraVision 4K HDR video processing.

Regarding the launch, Anku Jain, Managing Director, MediaTek India said, MediaTek has been collaborating with OEMs in India empowering incredible experiences supported by an extensive portfolio of smartphones and smart device technologies.

MediaTek Dimensity 7050 will allow OEMs to create exceptional smartphones with greater CPU performance, low-power, and incredibly smooth game experience.

Let us look at the features of the newly launched chipset in detail.

MediaTek Dimensity 7050 chipset Launched

The chip is power-efficient and belongs to the 6nm class. It has advanced 5G integration and is combined with MediaTek 5G UltraSave, which results in impressive and long-lasting performance. The MediaTek Dimensity 7050 enables smartphone manufacturers to produce 5G devices that are slim, lightweight, and visually appealing while also providing improved CPU performance, low power consumption, and a seamless gaming experience.

 

MediaTek Dimensity1080

 

MediaTek Dimensity 7050

Process TSMC 6nm TSMC 6nm
CPU, big cores 2 x Cortex-A78 @ 2.6GHz 2 x Cortex-A78 @ 2.6GHz
CPU, small cores 6 x Cortex-A55 @ 2.0GHz 6 x Cortex-A55 @ 2.0GHz
GPU Mali-G68 MC4 Mali-G68 MC4
RAM LPDDR5 LPDDR5
Storage UFS 3.1 UFS 3.1
Display 1080p+, 120Hz 1080p+, 120Hz
5G Dual SIM Dual SIM
Local wireless Wi-Fi 6, Bluetooth 5.2 Wi-Fi 6, Bluetooth 5.2

MediaTek Dimensity 7050 Chipset Key Features

MediaTek HyperEngine: The chipset is said to offer gamers intelligent speed and power saving. With the built-in 5G HSR mode, the phone will actively look for and connect to the cell tower with the lowest delay.

Fast speeds: The Arm Mali-G68 graphics engine and the octa-core CPU with two Arm Cortex-A78 processors clocked up to 2.6GHz provide superior performance, quick app response, and smooth gaming while extending battery life.

Support for 200MP photos and 4K HDR video: The chip supports 200MP main cameras and various hardware-based camera engines, resulting in larger, brighter, and sharper photos. Additionally, premium noise reduction techniques are integrated into the chip to enhance the overall quality of the images. The newly launched chipset also supports 4K HDR video.
AI for next-generation cameras: A specialised, multi-core AI processing unit lets a single camera do cool tricks like soft background (AI-bokeh) and selective focus, which are great for selfie vlogs and streams.

Wi-Fi 6: With 2×2 MIMO, Wi-Fi 6 lets you connect to the internet faster and more reliably. With Bluetooth 5 and GNSS built into the chip, wireless connectivity uses less power than other options that use separate chips.

Fast and efficient 5G: The chipset allows for faster and more efficient 5G connectivity by utilising both low and mid-band frequencies.

LAVA AGNI 2 5G KEY SPECIFICATIONS

Key Specs

RAM 8 GB
Processor MediaTek Dimensity 1080 MT6877V
Rear Camera 50 MP + 5 MP + 2 MP
Front Camera 16 MP
Battery 5000 mAh
Display 6.5 inches (16.51 cm)

General

Launch Date June 2, 2023 (Unofficial)
Operating System Android v13

Performance

Chipset MediaTek Dimensity 1080 MT6877V
CPU Octa core (2.6 GHz, Dual core, Cortex A78 + 2 GHz, Hexa Core, Cortex A55)
Architecture 64 bit
Fabrication 6 nm
Graphics Mali-G68 MC4
RAM 8 GB

Display

Display Type IPS LCD
Screen Size 6.5 inches (16.51 cm)
Resolution 1080 x 2460 pixels
Aspect Ratio 20:9
Pixel Density 413 ppi
Screen Protection Corning Gorilla Glass v3
Bezel-less display Yes with punch-hole display
Touch Screen Yes, Capacitive Touchscreen, Multi-touch
Refresh Rate 90 Hz

Camera

MAIN CAMERA
Camera Setup Triple
Resolution 50 MP, Primary Camera
5 MP, Ultra-Wide Angle Camera
2 MP, Depth Camera
Autofocus Yes
OIS Yes
Flash Yes, LED Flash
Image Resolution 8150 x 6150 Pixels
Settings Exposure compensation, ISO control
Shooting Modes Continuous Shooting
High Dynamic Range mode (HDR)
Camera Features Digital Zoom
Auto Flash
Face detection
Touch to focus
FRONT CAMERA
Camera Setup Single
Resolution 16 MP, Primary Camera

Battery

Capacity 5000 mAh
Type Li-Polymer
Removable No
Quick Charging Yes, Fast, 44W
USB Type-C Yes

Storage

Internal Memory 128 GB
Expandable Memory Yes, Up to 1 TB

Network & Connectivity

SIM Slot(s) Dual SIM, GSM+GSM
SIM Size SIM1: Nano, SIM2: Nano (Hybrid)
Network Support 5G Not Supported in India, 4G Supported in India, 3G, 2G
VoLTE Yes
SIM 1
4G Bands:
TD-LTE 2300(band 40)
FD-LTE 1800(band 3)
3G Bands:
UMTS 1900 / 2100 / 850 / 900 MHz
2G Bands:
GSM 1800 / 1900 / 850 / 900 MHz
GPRS:
Available
EDGE:
Available
SIM 2
4G Bands:
TD-LTE 2300(band 40)
FD-LTE 1800(band 3)
3G Bands:
UMTS 1900 / 2100 / 850 / 900 MHz
2G Bands:
GSM 1800 / 1900 / 850 / 900 MHz
GPRS:
Available
EDGE:
Available
Wi-Fi Yes, Wi-Fi 4 (802.11 b/g/n)
Wi-Fi Features Mobile Hotspot
Bluetooth Yes, v5.1
GPS Yes with A-GPS
USB Connectivity Mass storage device, USB charging

Multimedia

Loudspeaker Yes
Audio Jack 3.5 mm

Sensors

Fingerprint Sensor Yes
Fingerprint Sensor Position Side
Other Sensors Light sensor, Proximity sensor, Accelerometer

Faqs

1) What is the availability of Mediatek Dimensity 7050 ?

Ans) The MediaTek Dimensity 7050 will first power the Lava Agni 2 5G smartphone, which will be released in India soon. Furthermore, it is expected to power 5G devices that will be released in the global market this Q2, 2023.

2) MediaTek Dimensity 7050 announced; will power Lava Agni 2 5G.Details?

Ans) MediaTek has introduced yet another 7000 series chipset called the Dimensity 7050 which has similar specifications as the Dimensity 1080. This features 6nm-class technology, which enables enhanced power efficiency when combined with MediaTek 5G UltraSave to provide long-lasting performance.

It has an Octa-Core CPU with two Arm Cortex-A78 performance cores that can run at up to 2.6GHz and six Arm Cortex-A55 efficiency cores that can run at 2.0GHz, as well as a Mali-G68 graphics engine.

It supports 200MP main cameras, a plethora of hardware-based camera engines, and a specialized 4K HDR video capture engine while consuming little battery power. Furthermore, the MediaTek APU 550 enables a number of AI-camera enhancements.

It boasts HyperEngine technology, which provides integrated 5G HSR mode, in which the smartphone actively searches for and connects to the lowest latency accessible cell tower to reduce online ping. The innovative networking engine supports call and data concurrency, allowing gamers to keep a 5G data connection open and uninterrupted for their game while accepting a call on the second SIM.

The chipset uses Intelligent Refresh Rate Display technology to enable full HD+ displays up to 120Hz. It offers Wi-Fi 6 with 2×2 MIMO, Bluetooth 5.2, and GNSS, and faster 5G Carrier Aggregation (2CC-CA) with mixed duplex FDD+TDD that uses low and mid-band for higher speeds, greater reach, and a seamless handover.

3) MediaTek announces Dimensity 7050 chipset, will debut on Lava Agni 2 5G.Details ?

Ans) MediaTek is going through a rebranding phase with its recent chipset releases and the Dimensity 7050 is the latest addition. The newly announced SoC is identical to the Dimensity 1080 that launched back in November.
Dimensity 7050 is built on TSMC’s N6 chip production process and boasts 2x Arm Cortex-A78 performance cores clocked at 2.6GHz and 6x Arm Cortex-A55 power-efficiency cores humming at 2.0GHz. The GPU side is covered by the Arm Mali-G68 MC4.
The new chipset supports up to 200MP camera sensors and 4K video recording at 30FPS. It can handle up to 2520 x 1080px resolution displays with a 120Hz refresh rate and supports up to LPDDR5 RAM and UFS 3.1 storage. Wi-Fi 6, Bluetooth 5.2 and dual SIM 5G connectivity are also on board Dimensity 7050 will debut on the Lava Agni 2 5G smartphone in India soon.

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