4nm Technology Archives ~ My Mobile India

Highlights MediaTek Dimensity 7300 series features 4nm technology for enhanced performance and efficiency. Octa-core CPU with four Arm Cortex-A78 cores and four Arm Cortex-A55 cores. Enhanced gaming performance with Arm Mali-G615 GPU and HyperEngine optimizations. Supports 200MP main camera and advanced AI capabilities for superior photography. In a huge stride towards reshaping the mobile computing market, MediaTek unveils the release of the Dimensity 7300 and Dimensity 7300X chipsets. These chips are built using a sophisticated 4nm technology and are meant to bring about seamless multitasking, outstanding photography, fast-paced gaming, and AI-enhanced computing experiences in high-end mobile devices. Level up #AI & mobile gaming in high-tech smartphones & foldables w/ MediaTek Dimensity 7300 & 7300X. These ultra-efficient 4nm chips feature best-in-class power efficiency, performance, effortless multitasking, accelerated gaming, & AI-enhanced computing. https://t.co/1Ke6kC2cOH pic.twitter.com/ErPdCEONrH — MediaTek (@MediaTek) May 30, 2024 Inside these new chipsets, there's an octa-core CPU with four Arm Cortex-A78 cores running at up to 2.5GHz aoutnd four Arm Cortex-A55 cores. Compared to the earlier Dimensity 7050, MediaTek says that the A78 cores consume 25% less power due to the 4nm fabrication technology. “The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business. “Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.” Dimensity 7300 Series: Features MediaTek Dimensity 7300 series features 4nm technology for enhanced performance and efficiency Besides the strong CPU, the latest Arm Mali-G615 GPU, along with HyperEngine optimizations by MediaTek, is promising to get a much bigger bump in gaming performance. Dimensity 7300 series, with 20% faster frame rates and 20% higher power-saving than its competitors, is becoming an even more attractive option for mobile gaming fans. - BUSINESS. In an effort to enhance the gaming experience, these new chips take advantage of smart resource optimization, optimize 5G and Wi-Fi game connections, and introduce Bluetooth LE Audio technology featuring Dual-Link True Wireless Stereo Audio for a seamless and immersive gaming experience. It supports 200MP main camera and advanced AI capabilities for superior photography Dimensity 7300 chipsets will also give much to expect to photographers and content creators alike. Equipped with the MediaTek Imagiq 950, the chips bring an enhanced photography experience, which includes a best-in-class 12-bit HDR-ISP and support for a 200MP main camera to shoot simply amazing photos with great details and dynamic range. Hardware Engine, AI Features, Display Functions Enhanced gaming performance with Arm Mali-G615 GPU and HyperEngine optimizations Moreover, Dimensity 7300 comes with new hardware engines for precise MCNR, HWFD, and video HDR to ensure results in any light. The company further states that live focus photo performance is accelerated to go up to 1.3 times faster, and photo remastering is increased up to 1.5 times compared to the Dimensity 7050. While stepping up the AI game, the MediaTek APU 655 makes AI tasks twice as fast as on the Dimensity 7050. The new data types that the Dimensity 7300 chips use help save memory and let the AI models run more efficiently for an easy and smart user experience. Further, thanks to MediaTek's MiraVision 955, smartphones with Dimensity 7300 chips will be able to offer super-detailed screens with lifelike colours and support for global HDR so that videos look nothing short of the best. Catering to the growing demand for innovative form factors, the Dimensity 7300X is specifically designed to support flip-style foldable devices with dual displays, opening up new possibilities for cutting-edge smartphone designs. FAQs What technology is used in the MediaTek Dimensity 7300 series? The MediaTek Dimensity 7300 series is built using advanced 4nm technology, which enhances performance and power efficiency. What are the CPU specifications of the Dimensity 7300 and 7300X? Both chipsets feature an octa-core CPU with four Arm Cortex-A78 cores running at up to 2.5GHz and four Arm Cortex-A55 cores. How does the Dimensity 7300 series enhance gaming performance? The Dimensity 7300 series includes the Arm Mali-G615 GPU with HyperEngine optimizations, offering 20% faster frame rates and 20% higher power savings compared to competitors. What are the camera capabilities of the Dimensity 7300 series? The chipsets support a 200MP main camera and feature MediaTek Imagiq 950 with a 12-bit HDR-ISP, enhancing photography with great details and dynamic range. What AI features are included in the Dimensity 7300 series? The MediaTek APU 655 in the Dimensity 7300 series makes AI tasks twice as fast as the previous generation, optimizing memory usage and efficiency. MediaTek’s Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables. Details? MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays. Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. The 4nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio. The Dimensity 7300 chipsets also offer upgraded photography with the MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP with support for a 200MP main camera. Enhanced with new hardware engines providing precise noise reduction (MCNR), face detection (HWFD), and video HDR, the Dimensity 7300 lets users capture stunning images and videos in any lighting. Additionally, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range compared to competitor solutions, bringing out more details in videos. The MediaTek APU 655 significantly boosts AI task efficiency, delivering twice the performance of the Dimensity 7050. The Dimensity 7300 chips also accommodate new mixed precision data types to more efficiently utilize memory bandwidth and reduce memory requirements for larger AI models. With MediaTek’s MiraVision 955 built-in, the Dimensity 7300 SoCs support impressively detailed WFHD+ displays with 10-bit true color, along with support for global HDR standards, enhancing media streaming and playback. Additionally, the dedicated support for dual display flip phones on the Dimensity 7300X makes it easier for OEMs to meet the growing market demand for innovative form factors. What are the key features of the Dimensity 7300 and the Dimensity 7300X ? MediaTek 5G UltraSave 3.0+ technology incorporating a complete suite of R16 power saving enhancements, plus MediaTek’s own optimizations that provide between 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6GHz connectivity scenarios. Support for up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, providing faster downlink speeds within urban and suburban environments. Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity. Dual 5G SIM support with dual VoNR to give users more choice. Also Read: MediaTek Dimensity 9400 Could Likely Surpass Qualcomm’s Snapdragon 8 Gen 4 Also Read: MediaTek Dimensity 9400 Prepares to Challenge Snapdragon 8 Gen 4 Also Read: MediaTek Dimensity 9400 Set to Revolutionize Smartphones with Record Transistor Count

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