TSMC 4nm Process Archives ~ My Mobile India

Highlights MediaTek Dimensity 8300, built on TSMC's 4nm process, features an advanced octa-core CPU. The chipset includes the Mali-G615 MC6 GPU, offering improved performance and efficiency. APU 780 AI processor in the chipset enables innovative AI application development. Enhanced connectivity with a 5G modem and upgraded Wi-Fi 6E performance. MediaTek has unveiled its latest chipset, the Dimensity 8300, engineered for use in high-end 5G smartphones. This new addition is manufactured using TSMC's advanced 4nm process and integrates an octa-core CPU. The company expects the first smartphones powered by the Dimensity 8300 to hit the global market by the end of 2023, indicating a significant step in their 5G strategy. MediaTek Dimensity 8300: Features and Specs MediaTek Dimensity 8300: Features and Specs Talking about the internal structure, the CPU configuration includes four Arm Cortex-A715 cores and four Cortex-A510 cores, adhering to Arm's v9 CPU architecture, aiming for a notable performance boost. The chipset's GPU, the Mali-G615 MC6, is designed to offer enhanced performance and energy efficiency, potentially benefiting gaming and multimedia applications. MediaTek's focus with the Dimensity 8300 seems to be on balancing high-end features with efficient power consumption. A standout aspect of the Dimensity 8300 is its APU 780 AI processor, marking a significant step in AI integration for MediaTek. This processor is designed to support the development of applications utilizing large language models and stable diffusion, with claims of substantial improvements in AI performance over its predecessor, the Dimensity 8200. HyperEngine, Gaming, and Connectivity MediaTek Launches Dimensity 8300 for Mid-Range 5G Smartphones For video and photography, the chipset is equipped with MediaTek’s 14-bit HDR-ISP Imagiq 980. This feature is intended to enhance the quality of 4K60 HDR video recording, aligning with the growing demand for advanced multimedia capabilities in smartphones. The Dimensity 8300 also introduces MediaTek’s HyperEngine adaptive game technology, which aims to optimize battery life. This technology adjusts to computing demands and manages device temperature to ensure efficient gameplay. Connectivity is a key focus, with the chipset featuring a built-in 5G modem that conforms to the 3GPP Release-16 standard. It supports 3CC carrier aggregation, aiming for downlink speeds of up to 5.17Gbps. The modem is designed to enhance connectivity, particularly in environments with weaker signals. Other notable features of the Dimensity 8300 include: Improved memory speeds with LP5x 8533Mbps and uFS4.0 MCQ memory, indicating faster performance compared to the previous generation. The MediaTek 5G UltraSave 3.0+ technology, which purportedly enhances 5G power efficiency in daily use. Upgraded Wi-Fi 6E performance with 160 MHz bandwidth and technology to ensure seamless operation of wireless peripherals. The introduction of the Dimensity 5G Open Resource Architecture (DORA), which allows for customization in smartphone design. FAQs What are the main features of the MediaTek Dimensity 8300? The MediaTek Dimensity 8300 is a high-performance chipset for 5G smartphones, featuring an octa-core CPU, an advanced Mali-G615 MC6 GPU for better gaming and multimedia experiences, and an APU 780 AI processor for supporting AI-driven applications. It also boasts enhanced connectivity with a built-in 5G modem and Wi-Fi 6E capabilities. How does the Dimensity 8300 improve AI capabilities in smartphones? The Dimensity 8300 includes the APU 780 AI processor, which is specifically designed to enhance AI performance in smartphones. This allows for the development of applications utilizing large language models and stable diffusion, significantly improving AI computation and performance compared to its predecessor. What advancements in connectivity does the Dimensity 8300 offer? The Dimensity 8300 features a 5G modem compliant with the 3GPP Release-16 standard, supporting 3CC carrier aggregation for faster downlink speeds. Additionally, it offers upgraded Wi-Fi 6E performance with 160 MHz bandwidth, ensuring more reliable and faster internet connections.

TSMC 4nm Process

MediaTek Launches Dimensity 8300 for Mid-Range 5G Smartphones

MediaTek Dimensity 8300 and Qualcomm Snapdragon 7 Gen 3 Set for Imminent Launch